发明申请
- 专利标题： Method for Producing a MEMS Package
- 专利标题（中）： 制造MEMS封装的方法
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申请号： US12627707申请日： 2009-11-30
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公开(公告)号： US20100127377A1公开(公告)日： 2010-05-27
- 发明人: Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
- 申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
- 优先权： DE102007025992.3 20070604
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L21/98
摘要：
A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
公开/授权文献
- US08404516B2 Method for producing a MEMS package 公开/授权日：2013-03-26
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