发明申请
- 专利标题： Cooling Structures and Methods
- 专利标题（中）： 冷却结构与方法
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申请号： US12275731申请日： 2008-11-21
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公开(公告)号： US20100127390A1公开(公告)日： 2010-05-27
- 发明人: Hans-Joachim Barth
- 申请人： Hans-Joachim Barth
- 主分类号： H01L23/473
- IPC分类号： H01L23/473 ; F28F7/00 ; B23P17/00 ; H01L23/467
摘要：
Cooling structures and methods, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a cooling structure for a semiconductor device includes at least one channel defined between a first workpiece and a second workpiece. The second workpiece is bonded to the first workpiece. The at least one channel is adapted to retain a fluid.
公开/授权文献
- US08269341B2 Cooling structures and methods 公开/授权日：2012-09-18