发明申请
- 专利标题： Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
- 专利标题（中）： 半导体芯片层压板和粘合剂组合物
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申请号： US12625862申请日： 2009-11-25
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公开(公告)号： US20100133703A1公开(公告)日： 2010-06-03
- 发明人: Yasunori Karasawa , Isao Ichikawa
- 申请人： Yasunori Karasawa , Isao Ichikawa
- 申请人地址： JP Tokyo
- 专利权人： LINTEC CORPORATION
- 当前专利权人： LINTEC CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-303743 20081128
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; C09J163/04 ; B32B27/38
摘要：
A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organic phosphine compound (D) as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.
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