Provided is a method for manufacturing a nozzle plate which has a through hole having an ejection port. In the method, the through hole, which has one opening as an ejection port for ejecting the liquid, is arranged on a Si substrate by an anisotropic etching method wherein etching and side wall protection film formation are alternately repeated to the Si substrate and the following steps are performed in the following order; forming a film to be an etching mask on a surface of the Si substrate whereupon the ejection port is to be formed, forming the etching mask pattern having an opening for forming the thorough hole by performing photolithography and etching to a film to be the etching mask, and performing the etching by the anisotropic etching method by satisfying the conditional expression.