Invention Application
- Patent Title: Compound Body and a Process for the Production of a Mechanical Connection
- Patent Title (中): 复合体和机械连接的生产过程
-
Application No.: US12704112Application Date: 2010-02-11
-
Publication No.: US20100136872A1Publication Date: 2010-06-03
- Inventor: Ingo Dünisch
- Applicant: Ingo Dünisch
- Applicant Address: DE Wiesbaden
- Assignee: PerkinElmer Optoelectronics GmbH & Co. KG
- Current Assignee: PerkinElmer Optoelectronics GmbH & Co. KG
- Current Assignee Address: DE Wiesbaden
- Priority: DE10257477.4 20021209
- Main IPC: H01J9/00
- IPC: H01J9/00
Abstract:
A compound body has a first body part (15) made of glass and a mechanical connection (20, 60) which is melted on the first body part (15) and contains aluminum.
Public/Granted literature
- US07955153B2 Compound body and a process for the production of a mechanical connection Public/Granted day:2011-06-07
Information query
