发明申请
- 专利标题： BONDING TOOL, ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
- 专利标题（中）： 连接工具，电子元件安装设备和电子元件安装方法
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申请号： US12630943申请日： 2009-12-04
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公开(公告)号： US20100140326A1公开(公告)日： 2010-06-10
- 发明人: Hiroshi Ebihara , Katsuhiko Watanabe , Ryo Fujita
- 申请人： Hiroshi Ebihara , Katsuhiko Watanabe , Ryo Fujita
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2008-311866 20081208; JP2009-260297 20091113
- 主分类号： B23K1/06
- IPC分类号： B23K1/06 ; B23K37/00 ; B23K20/10
摘要：
A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.
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