发明申请
US20100140786A1 SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA
审中-公开
具有外部接合区域的半导体功率模块封装
- 专利标题： SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA
- 专利标题（中）： 具有外部接合区域的半导体功率模块封装
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申请号： US12632298申请日： 2009-12-07
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公开(公告)号： US20100140786A1公开(公告)日： 2010-06-10
- 发明人: Keun-hyuk LEE , Young-sun KO , Seung-won LIM , Man-kyo JUNG , Seung-yong CHOI
- 申请人： Keun-hyuk LEE , Young-sun KO , Seung-won LIM , Man-kyo JUNG , Seung-yong CHOI
- 申请人地址： KR Bucheon-si
- 专利权人： FAIRCHILD KOREA SEMICONDUCTOR LTD.
- 当前专利权人： FAIRCHILD KOREA SEMICONDUCTOR LTD.
- 当前专利权人地址： KR Bucheon-si
- 优先权： KR10-2008-0123150 20081205
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
Provided is a semiconductor power module package including a bonding area on a direct bonding cupper (DBC) board. The semiconductor power module package includes: one or more semiconductor chips; a sealing member sealing the one or more semiconductor chips; a plurality of leads electrically connected to the one or more semiconductor chips and exposed from the sealing member; and an external bonding member electrically connected to the one or more semiconductor chips and electrically connecting an external circuit board exposed from the sealing member.
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