发明申请
- 专利标题： DE-CLAMPING WAFERS FROM AN ELECTROSTATIC CHUCK
- 专利标题（中）： 来自静电切割机的去夹具
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申请号： US12331619申请日： 2008-12-10
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公开(公告)号： US20100142113A1公开(公告)日： 2010-06-10
- 发明人: William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
- 申请人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
- 申请人地址： US MA Beverly
- 专利权人： Axcelis Technologies, Inc.
- 当前专利权人： Axcelis Technologies, Inc.
- 当前专利权人地址： US MA Beverly
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
One embodiment of the present invention relates to a method for declamping a semiconductor wafer that is electrically adhered to a surface of an electrostatic chuck by a clamping voltage. In this method, the clamping voltage is deactivated. For a time following the deactivation, a first region of the wafer is lifted an first distance from the surface of the electrostatic chuck while a second region of the wafer remains adhered to the surface of the electrostatic chuck. A predetermined condition is monitored during the time. The second region is lifted from the surface of the electrostatic chuck when the predetermined condition is met.
公开/授权文献
- US08270142B2 De-clamping wafers from an electrostatic chuck 公开/授权日：2012-09-18
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