An electronic, in particular microelectronic, functional group and to a method for its production are described. The method can include the following steps: a) coating of a mount with a non-conductive adhesive; b) application of a conductor structure to a subarea of the adhesive layer; c) arrangement of an electronic component with at least one external electrical connecting contact on the adhesive layer and on the conductor structure, with the at least one connecting contact of the electronic component being brought directly into contact with the conductor structure, and with a part of the outer casing of the component being brought directly into contact with the adhesive layer. The method can allow electronic, in particular microelectronic, functional groups to be produced with care, quickly and in particular at low cost.