Provided is an imaging device having a wastebin assembly and a hopper assembly. The imaging device includes a photoconductive member mounted within the wastebin assembly and a developer member mounted within the hopper assembly. The wastebin assembly and hopper assembly are connected by a biasing element that pushes the hopper assembly toward the wastebin assembly such that the developer member and the photoconductive member are pushed into contact with each other forming a nip between the two members.