发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US12303865申请日： 2007-05-17
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公开(公告)号： US20100148298A1公开(公告)日： 2010-06-17
- 发明人: Fumitomo Takano , Shinya Watanabe , Tsukasa Aiba , Joji Nakashima , Hiroshi Otsuka
- 申请人： Fumitomo Takano , Shinya Watanabe , Tsukasa Aiba , Joji Nakashima , Hiroshi Otsuka
- 申请人地址： JP Minato-ku, Tokyo
- 专利权人： .Honda Motor Co., Ltd.,
- 当前专利权人： .Honda Motor Co., Ltd.,
- 当前专利权人地址： JP Minato-ku, Tokyo
- 优先权： JP2006-161616 20060609; JP2006-161618 20060609; JP2006-276906 20061010
- 国际申请： PCT/JP2007/060563 WO 20070517
- 主分类号： H01L27/06
- IPC分类号： H01L27/06
摘要：
A semiconductor device is composed of a pair of semiconductor chips (402, 404) arranged parallel on the same flat plane; a high voltage bus bar (21) bonded on the surface on the collector side of one semiconductor chip (402); a low voltage bus bar (23) connected to the surface on the emitter side of the other semiconductor chip (404) with a bonding wire (27); a first metal wiring board (24-1) connected to the surface on the emitter side of the semiconductor chip (402) with a bonding wire (26); a second metal wiring board (24-2) bonded on the surface on the collector side of the semiconductor chip (404); a third metal wiring board (24-3) connected to the first metal wiring board (24-1); a fourth metal wiring board (24-4) connected by being bent from an end portion of the second metal wiring board (24-2); and an output bus bar (24) having output terminals (405) extending from each end portion of the third metal wiring board (24-3) and that of the fourth metal wiring board (24-4).
公开/授权文献
- US08129836B2 Semiconductor device 公开/授权日：2012-03-06