发明申请
- 专利标题： THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 热固性环氧树脂组合物和半导体器件
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申请号： US12637359申请日： 2009-12-14
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公开(公告)号： US20100148380A1公开(公告)日： 2010-06-17
- 发明人: Masaki Hayashi , Yusuke Taguchi , Kazutoshi Tomiyoshi , Tomoyoshi Tada
- 申请人： Masaki Hayashi , Yusuke Taguchi , Kazutoshi Tomiyoshi , Tomoyoshi Tada
- 优先权： JP2008-318429 20081215
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; C08L63/00
摘要：
A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12 (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
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