Invention Application
- Patent Title: METHOD FOR MANUFACTURING A POWER SEMICONDUCTOR DEVICE
- Patent Title (中): 用于制造功率半导体器件的方法
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Application No.: US12635975Application Date: 2009-12-11
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Publication No.: US20100151650A1Publication Date: 2010-06-17
- Inventor: Arnost Kopta , Munaf Rahimo
- Applicant: Arnost Kopta , Munaf Rahimo
- Applicant Address: CH Zuerich
- Assignee: ABB Technology AG
- Current Assignee: ABB Technology AG
- Current Assignee Address: CH Zuerich
- Priority: EP08171450.3 20081212
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method of manufacturing a power semiconductor device is provided. A first oxide layer is produced on a first main side of a substrate of a first conductivity type. A structured gate electrode layer with at least one opening is then formed on the first main side on top of the first oxide layer. A first dopant of the first conductivity type is implanted into the substrate on the first main side using the structured gate electrode layer as a mask, and the first dopant is diffused into the substrate. A second dopant of a second conductivity type is then implanted into the substrate on the first main side, and the second dopant is diffused into the substrate. After diffusing the first dopant into the substrate and before implanting the second dopant into the substrate, the first oxide layer is partially removed. The structured gate electrode layer can be used as a mask for implanting the second dopant.
Public/Granted literature
- US08324062B2 Method for manufacturing a power semiconductor device Public/Granted day:2012-12-04
Information query
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