Invention Application
US20100155228A1 SPUTTERING APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
审中-公开
溅射装置及制造电子装置的方法
- Patent Title: SPUTTERING APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Patent Title (中): 溅射装置及制造电子装置的方法
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Application No.: US12639220Application Date: 2009-12-16
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Publication No.: US20100155228A1Publication Date: 2010-06-24
- Inventor: Shoji Takiguchi , Hideki Ueno , Hiroshi Takano
- Applicant: Shoji Takiguchi , Hideki Ueno , Hiroshi Takano
- Applicant Address: JP Kawasaki-shi
- Assignee: CANON ANELVA CORPORATION
- Current Assignee: CANON ANELVA CORPORATION
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP2008-327696 20081224
- Main IPC: C23C14/34
- IPC: C23C14/34

Abstract:
A sputtering apparatus includes a rotatable rotary member to which a target is attached, connection terminals, and feeding terminals. The connection terminals are arranged on the end portion of the rotary member in a direction along the axis of rotation of the rotary member, and are electrically connected to the target. The feeding terminals supply electric power to the target via the connection terminals. When the rotary member is rotated while the feeding terminals are in contact with the end portion of the rotary member, the electrical connection or insulation state between the feeding terminals and connection terminals is switched.
Information query
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