发明申请
US20100155863A1 METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING A SILICON MEMS MICROPHONE
审中-公开
制造包含硅MEMS麦克风的微电子封装的方法
- 专利标题: METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING A SILICON MEMS MICROPHONE
- 专利标题(中): 制造包含硅MEMS麦克风的微电子封装的方法
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申请号: US12063117申请日: 2006-08-04
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公开(公告)号: US20100155863A1公开(公告)日: 2010-06-24
- 发明人: Johannes Wilhelmus Weekamp
- 申请人: Johannes Wilhelmus Weekamp
- 申请人地址: NL EINDHOVEN
- 专利权人: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
- 当前专利权人: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
- 当前专利权人地址: NL EINDHOVEN
- 优先权: EP05107401.1 20050811
- 国际申请: PCT/IB06/52698 WO 20060804
- 主分类号: H01L29/84
- IPC分类号: H01L29/84 ; H01L21/02 ; H04R25/00
摘要:
A method for manufacturing a microelectronic package comprising a silicon MEMS microphone comprises the following steps: providing a basic panel (100) having several rows of interconnected substrates (90), wherein the substrates (90) are provided with electrically conductive connection pads (31), electrically conductive tracks (33), and a grid (40) comprising tiny holes (41); arranging an IC chip (50), a silicon MEMS microphone (60) and a ring-shaped element (95) on the substrates (90), wherein the ring-shaped element (95) is arranged around the microphone (60); and folding the substrates (90) in three, wherein an open side of the ring-shaped element (95) is closed. The IC chip (50) and the microphone (60) are safely accommodated in the package (5) that is obtained in this way. The connection pads (31) allow for easy connection of the package (5) to another device, while 32 electrical connections to the IC chip (50) are also easily realized through these connection pads (31). An electrical connection of the microphone (60) to the IC chip (50) is realized through the electrically conductive tracks (33).