发明申请
- 专利标题： METHOD OF MULTI-ANGLED BUMP PROCESSING FOR MAGNETIC POLE FABRICATION AND SYSTEMS THEREOF
- 专利标题（中）： 用于磁极制造及其系统的多重保护加工方法
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申请号： US12341834申请日： 2008-12-22
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公开(公告)号： US20100157474A1公开(公告)日： 2010-06-24
- 发明人: Wen-Chien David Hsiao , Vladimir Nikitin , Aron Pentek , Sue Siyang Zhang , Yi Zheng
- 申请人： Wen-Chien David Hsiao , Vladimir Nikitin , Aron Pentek , Sue Siyang Zhang , Yi Zheng
- 主分类号： G11B5/127
- IPC分类号： G11B5/127
摘要：
A system according to one embodiment includes a magnetic pole; a bump structure above the pole, the bump structure having a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the pole, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the pole, wherein the second angle is greater than the first angle; and a shield above the bump structure. A method according to one embodiment includes forming a bump layer above a magnetic pole; removing a portion of the bump layer for forming a step therein; and milling the bump layer for defining thereon a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the bump layer, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the bump layer, wherein the second angle is greater than the first angle.