发明申请
- 专利标题： PACKAGE FOR MICRO-ELECTRO-MECHANICAL SYSTEMS OF THE MEMS TYPE AND CORRESPONDING MANUFACTURING PROCESS
- 专利标题（中）： MEMS类型的微机电系统和相关制造工艺的封装
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申请号： US12645093申请日： 2009-12-22
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公开(公告)号： US20100165581A1公开(公告)日： 2010-07-01
- 发明人: Federico Giovanni ZIGLIOLI , Mark Andrew SHAW
- 申请人： Federico Giovanni ZIGLIOLI , Mark Andrew SHAW
- 申请人地址： IT Agrate Brianza
- 专利权人： STMICROELECTRONICS S.R.L.
- 当前专利权人： STMICROELECTRONICS S.R.L.
- 当前专利权人地址： IT Agrate Brianza
- 优先权： ITMI2008A002321 20081224
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H01L29/84 ; H01L21/02 ; H05K1/00 ; H05K7/00
摘要：
An embodiment of a package for Micro-Electro-Mechanical Systems of the MEMS type comprising a base for the assembly of said MEMS and a protective envelope, for containing the MEMS. The base is a multi-layer structure with at least one layer of composite material to make a substrate and at least one flexible wing projecting from the substrate, such base being a monolithic element suitable for being connected to external connection tracks.
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