发明申请
US20100165585A1 CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES
审中-公开
电源管理集成电路芯片封装及相关技术
- 专利标题: CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES
- 专利标题(中): 电源管理集成电路芯片封装及相关技术
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申请号: US12645361申请日: 2009-12-22
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公开(公告)号: US20100165585A1公开(公告)日: 2010-07-01
- 发明人: Mou-Shiung Lin , Jin-Yuan Lee
- 申请人: Mou-Shiung Lin , Jin-Yuan Lee
- 申请人地址: TW Hsin-Chu
- 专利权人: MEGICA CORPORATION
- 当前专利权人: MEGICA CORPORATION
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H05K7/00
- IPC分类号: H05K7/00 ; G05F1/00
摘要:
Chip packages having power management integrated circuits are described. Power management integrated circuits can be combined with on-chip passive devices, and can provide voltage regulation, voltage conversion, dynamic voltage scaling, and battery management or charging. The on-chip passive devices can include inductors, capacitors, or resistors. Power management using a built-in voltage regulator or converter can provide for immediate adjustment of the voltage range to that which is needed. This improvement allows for easier control of electrical devices of different working voltages and decreases response time of electrical devices. Related fabrication techniques are described.
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