Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.