发明申请
- 专利标题： Method and Composition for Chemical Mechanical Planarization of A Metal
- 专利标题（中）： 金属化学机械平面化方法与组成
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申请号： US12632111申请日： 2009-12-07
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公开(公告)号： US20100167545A1公开(公告)日： 2010-07-01
- 发明人: Xiaobo Shi , Bentley J. Palmer , Rebecca A. Sawayda , Fadi Abdallah Coder , Victoria Perez
- 申请人： Xiaobo Shi , Bentley J. Palmer , Rebecca A. Sawayda , Fadi Abdallah Coder , Victoria Perez
- 申请人地址： US PA Allentown
- 专利权人： DuPont Air Products Nanomaterials LLC
- 当前专利权人： DuPont Air Products Nanomaterials LLC
- 当前专利权人地址： US PA Allentown
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; C09K13/00
摘要：
A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low within a wafer non-uniformity values and low residue levels remaining after polishing.
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