An electrically conductive tape for walls and ceilings is provided. The tape includes a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling and at least one conductive layer applied to the substrate. The conductive layer is penetrable by at least a conductor of an electrical device to provide an electrical connection thereto. In one embodiment the conductive layer is formed from a conductive composition including an electrically conductive material therein. The conductive composition can include a conductive ink. A method of manufacturing an electrically conductive tape or film for walls and ceilings is also provided. The method includes providing a conductive composition including an electrically conductive material therein, and providing a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling. The method also includes applying the conductive composition to the substrate forming a conductive layer attached to the substrate, the conductive layer being penetrable by a conductor of an electrical device.