发明申请
- 专利标题： POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD
- 专利标题（中）： 聚酰胺树脂，胶粘剂，柔性基材材料，柔性层压板和柔性印刷接线板
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申请号： US12444234申请日： 2007-08-20
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公开(公告)号： US20100170701A1公开(公告)日： 2010-07-08
- 发明人: Masaki Takeuchi , Katsuyuki Masuda , Kenichi Tomioka , Takako Ejiri
- 申请人： Masaki Takeuchi , Katsuyuki Masuda , Kenichi Tomioka , Takako Ejiri
- 优先权： JP2006-273005 20061004; JP2007-059093 20070308
- 国际申请： PCT/JP2007/066100 WO 20070820
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; C08G73/14 ; B32B15/08
摘要：
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).