发明申请
- 专利标题： SEMICONDUCTOR PACKAGE SYSTEM WITH THERMAL DIE BONDING
- 专利标题（中）： 具有热连接的半导体封装系统
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申请号： US12729204申请日： 2010-03-22
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公开(公告)号： US20100176503A1公开(公告)日： 2010-07-15
- 发明人: Sangkwon Lee , Tae Keun Lee
- 申请人： Sangkwon Lee , Tae Keun Lee
- 主分类号： H01L23/367
- IPC分类号： H01L23/367
摘要：
A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of the plurality of thermal vias using the solder mask. An integrated circuit die is attached to the plurality of thermally conductive bumps. An encapsulant encapsulates the integrated circuit die.
公开/授权文献
- US08304922B2 Semiconductor package system with thermal die bonding 公开/授权日：2012-11-06
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