Invention Application
- Patent Title: TRANSPARENT COMPOSITE COMPOUND
- Patent Title (中): 透明复合化合物
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Application No.: US12617357Application Date: 2009-11-12
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Publication No.: US20100178478A1Publication Date: 2010-07-15
- Inventor: Byeong-Soo BAE , Jungho JIN , Seung Cheol YANG , Ji Hoon KO
- Applicant: Byeong-Soo BAE , Jungho JIN , Seung Cheol YANG , Ji Hoon KO
- Applicant Address: JP Daejeon
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Daejeon
- Priority: KR10-2009-0002687 20090113; KR10-2009-0105759 20091104
- Main IPC: B32B7/02
- IPC: B32B7/02 ; C08L83/06

Abstract:
Provided is a non-hydrolytic transparent composite composition having excellent transparency and heat resistance, and a low thermal expansion coefficient. Particularly, the transparent composite composition includes a glass filler dispersed in a crosslinked transparent resin produced by a non-hydrolytic reaction. The non-hydrolytic transparent siloxane resin is a resin having Si—O (siloxane) bonds, a resin having at least one kind of heterometal bonds, including Si—O bonds, or the resin further containing other ingredients. When the transparent siloxane resin produced by a non-hydrolytic reaction forms a composite in combination with the glass filler, the composite realizes high transparency and heat resistance, as well as a low thermal expansion coefficient. Therefore, the transparent composite composition is useful as a substrate for thin film transistor (TFT) devices, display devices and optical devices.
Public/Granted literature
- US08372504B2 Transparent composite compound Public/Granted day:2013-02-12
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