发明申请
US20100182013A1 PROBING APPARATUS WITH TEMPERATURE-ADJUSTING MODULES FOR TESTING SEMICONDUCTOR DEVICES
审中-公开
用于测试半导体器件的温度调节模块的探测器
- 专利标题： PROBING APPARATUS WITH TEMPERATURE-ADJUSTING MODULES FOR TESTING SEMICONDUCTOR DEVICES
- 专利标题（中）： 用于测试半导体器件的温度调节模块的探测器
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申请号： US12418021申请日： 2009-04-03
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公开(公告)号： US20100182013A1公开(公告)日： 2010-07-22
- 发明人: CHOON LEONG LOU
- 申请人： CHOON LEONG LOU
- 申请人地址： TW HSINCHU CITY
- 专利权人： STAR TECHNOLOGIES INC.
- 当前专利权人： STAR TECHNOLOGIES INC.
- 当前专利权人地址： TW HSINCHU CITY
- 优先权： TW098101472 20090116
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
A probing apparatus for testing semiconductor devices comprises an upper guiding plate having a plurality of upper guiding holes, a bottom guiding plate having a plurality of bottom guiding holes, a plurality of vertical probes disposed between the upper guiding holes of the upper guiding plate and the bottom guiding holes of the bottom guiding plate, and a temperature-adjusting module including at least one flow line configured to direct a fluid into a space between the upper guiding plate and the bottom guiding plate.
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