发明申请
- 专利标题： SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 基板及其制造方法
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申请号： US12749143申请日： 2010-03-29
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公开(公告)号： US20100184289A1公开(公告)日： 2010-07-22
- 发明人: Tadahiro OHMI , Akihiro Morimoto , Teruhiko Suzuki , Takeyoshi Kato
- 申请人： Tadahiro OHMI , Akihiro Morimoto , Teruhiko Suzuki , Takeyoshi Kato
- 优先权： JP2003-159315 20030604
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
A photosensitive transparent resin film, provided selectively with a groove reaching a transparent substrate is formed on the transparent substrate, and a wiring portion is provided in the groove substantially in flush with the photosensitive transparent resin film. The wiring portion can be formed quickly while controlling the thickness easily by preprocessing the surface of the photosensitive transparent resin film or the bottom face of the groove before the wiring portion is set in the groove.
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