发明申请
- 专利标题： LOW PROFILE POWER CONNECTOR HAVING HIGH CURRENT DENSITY
- 专利标题（中）： 具有高电流密度的低剖面电源连接器
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申请号： US12687237申请日： 2010-01-14
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公开(公告)号： US20100184339A1公开(公告)日： 2010-07-22
- 发明人: Hung Viet Ngo , Scott A. Kleinle , Timothy W. Houtz
- 申请人： Hung Viet Ngo , Scott A. Kleinle , Timothy W. Houtz
- 主分类号： H01R33/00
- IPC分类号： H01R33/00
摘要：
A receptacle power connector is provided having first and second rows of electrical power contacts retained in a connector housing. The connector housing has a low profile, and the power contacts are arranged in rows that each achieves a current density of about 120 Amps/linear inch (2.54 cm).
公开/授权文献
- US08043097B2 Low profile power connector having high current density 公开/授权日：2011-10-25
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