发明申请
US20100188656A1 Surface Inspection Method and Surface Inspection Apparatus 有权
表面检查方法和表面检查装置

Surface Inspection Method and Surface Inspection Apparatus
摘要:
Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
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