发明申请
US20100202126A1 Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure 审中-公开
堆叠安装结构和堆叠安装结构的制造方法

  • 专利标题: Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure
  • 专利标题(中): 堆叠安装结构和堆叠安装结构的制造方法
  • 申请号: US12678855
    申请日: 2008-09-16
  • 公开(公告)号: US20100202126A1
    公开(公告)日: 2010-08-12
  • 发明人: Mikio NakamuraYu Kondo
  • 申请人: Mikio NakamuraYu Kondo
  • 申请人地址: JP Tokyo
  • 专利权人: OLYMPUS CORPORATION
  • 当前专利权人: OLYMPUS CORPORATION
  • 当前专利权人地址: JP Tokyo
  • 优先权: JPJP2007-240785 20070918; JPJP2008-091636 20080331
  • 国际申请: PCT/JP2008/066655 WO 20080916
  • 主分类号: H05K1/11
  • IPC分类号: H05K1/11 H05K13/00
Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure
摘要:
There is provided a stacked mounting structure in which, it is possible to realize a narrowing of pitch and to secure a height which enables to mount components to be mounted, and a method of manufacturing stacked mounting structure.The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.
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