发明申请
US20100202613A1 PACKET BUNDLING AT THE PDCP LAYER WITH CIPHERING ON THE PDCP SDU
审中-公开
在PDCP SDU上的PDCP层上的分组包装
- 专利标题: PACKET BUNDLING AT THE PDCP LAYER WITH CIPHERING ON THE PDCP SDU
- 专利标题(中): 在PDCP SDU上的PDCP层上的分组包装
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申请号: US12652656申请日: 2010-01-05
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公开(公告)号: US20100202613A1公开(公告)日: 2010-08-12
- 发明人: Siddharth Ray , Ashwin Sampath
- 申请人: Siddharth Ray , Ashwin Sampath
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM INCORPORATED
- 当前专利权人: QUALCOMM INCORPORATED
- 当前专利权人地址: US CA San Diego
- 主分类号: H04L9/00
- IPC分类号: H04L9/00
摘要:
Certain aspects of the present disclosure propose techniques for bundling and ciphering service data units (SDU) in the packet data convergence protocol (PDCP) layer. The proposed techniques increase the data rate of the communication system. At the transmitter side, the PDCP layer may bundle SDUs and cipher each SDU individually before submitting them to a lower layer. At the receiver-side, the PDCP layer may unbundle and decipher the SDUs before submitting them to higher layers.
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