发明申请
- 专利标题: Multilayer Circuit Board and Use of a Multilayer Circuit Board
- 专利标题(中): 多层电路板和多层电路板的使用
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申请号: US12678927申请日: 2008-09-16
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公开(公告)号: US20100208436A1公开(公告)日: 2010-08-19
- 发明人: Dieter Cremer , Reinfried Grimmel
- 申请人: Dieter Cremer , Reinfried Grimmel
- 优先权: DE102007044602.2 20070919
- 国际申请: PCT/EP2008/062297 WO 20080916
- 主分类号: H05K1/18
- IPC分类号: H05K1/18
摘要:
A multilayer circuit board having a security cell having security-related electronic components disposed thereon. The security cell is covered by a circuit path arrangement having circuit path segments disposed close to one another, and by an insulation layer. Penetration and thus manipulation of the security-related components is thus largely prevented.
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