发明申请
- 专利标题: PACKET BUNDLING AT THE PDCP LAYER
- 专利标题(中): 在PDCP层的包装
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申请号: US12652636申请日: 2010-01-05
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公开(公告)号: US20100208632A1公开(公告)日: 2010-08-19
- 发明人: Siddharth Ray , Ashwin Sampath
- 申请人: Siddharth Ray , Ashwin Sampath
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM INCORPORATED
- 当前专利权人: QUALCOMM INCORPORATED
- 当前专利权人地址: US CA San Diego
- 主分类号: H04B7/00
- IPC分类号: H04B7/00 ; H04L29/02
摘要:
Certain aspects of the present disclosure provide a technique for bundling the received service data units (SDU) in a first communication layer to generate a protocol data unit (PDU) to pass to a second communication layer. For example, one or more packet data convergence protocol (PDCP) SDUs may be concatenated to generate a PDCP PDU and be sent to a radio link control (RLC) layer in the transmitter side. Similarly, one or more PDCP SDUs may be extracted from a PDCP PDU in the receiver side.
公开/授权文献
- US08711881B2 Packet bundling at the PDCP layer 公开/授权日:2014-04-29
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