发明申请
US20100208920A1 ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME
审中-公开
通过成型制造的电子设备，用于制造它们的方法和模具以及使用该电子设备的电子应用
- 专利标题： ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME
- 专利标题（中）： 通过成型制造的电子设备，用于制造它们的方法和模具以及使用该电子设备的电子应用
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申请号： US12629672申请日： 2009-12-02
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公开(公告)号： US20100208920A1公开(公告)日： 2010-08-19
- 发明人: Duk Woo LEE , Jae Suk SUNG , Dae Kyu LEE , Tae Seok YANG , Young Ho JEON
- 申请人： Duk Woo LEE , Jae Suk SUNG , Dae Kyu LEE , Tae Seok YANG , Young Ho JEON
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2009-0012410 20090216
- 主分类号： H04R3/00
- IPC分类号： H04R3/00 ; H05K5/00 ; B29C45/14
摘要：
An electronic device manufactured by molding according to an aspect of the invention may include a board having a circuit component mounted thereon; a cable transmitting a signal from an external source to the board; a clamp securing the cable to the board; and a casing molding unit integrally molded with the board and the clamp from a resin material to define the outer appearance.
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