发明申请
US20100208933A1 ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME
审中-公开
通过成型制造的电子设备，用于制造它们的方法和模具以及使用该电子设备的电子应用
- 专利标题： ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME
- 专利标题（中）： 通过成型制造的电子设备，用于制造它们的方法和模具以及使用该电子设备的电子应用
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申请号： US12629716申请日： 2009-12-02
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公开(公告)号： US20100208933A1公开(公告)日： 2010-08-19
- 发明人: Duk Woo Lee , Jae Suk Sung , Dae Kyu Lee , Tae Sook Yang , Young Ho Jeon
- 申请人： Duk Woo Lee , Jae Suk Sung , Dae Kyu Lee , Tae Sook Yang , Young Ho Jeon
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2009-0012409 20090216
- 主分类号： H04R1/02
- IPC分类号： H04R1/02 ; B29B13/02 ; B29C45/14
摘要：
An electronic device manufactured by molding according to an aspect of the invention may include a driving unit supplying a signal upon being pressed and then returning to its original state; a board having the driving unit mounted thereon; a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance.
公开/授权文献
- US1248433A Fusible link. 公开/授权日：1917-11-27