发明申请
- 专利标题： Manufacturing apparatus for semiconductor device, controlling method for the manufacturing apparatus, and storage medium storing control program for the manufacturing apparatus
- 专利标题（中）： 半导体装置的制造装置，制造装置的控制方法和存储用于制造装置的控制程序的存储介质
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申请号： US12656560申请日： 2010-02-03
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公开(公告)号： US20100211207A1公开(公告)日： 2010-08-19
- 发明人: Takashi Murakami
- 申请人： Takashi Murakami
- 申请人地址： JP Kawasaki
- 专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人地址： JP Kawasaki
- 优先权： JP34566/2009 20090217
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; G06F19/00
摘要：
The manufacturing apparatus for a semiconductor device includes: a stage information obtaining portion for obtaining stage information that is information for specifying an exposure stage used in an exposure process of a wafer to be heated from an exposure unit including a plurality of exposure stages on which the wafer is placed; and a temperature setting portion for setting heating temperature of a heating apparatus for heating the wafer to be heated. The temperature setting portion sets the heating temperature based on the stage information individually for each of the plurality of exposure stages.
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