Information of a first type is determined at an integrated circuit die of a data processing device included an integrated circuit package. The integrated circuit package includes the first integrated circuit die and a second integrated circuit die. Information of a second type is determined at the integrated circuit die. The first and second type of information is transmitted from the integrated circuit die to another integrated circuit die using a time-divided multiplexed protocol by transmitting the first information during a first time slot of the protocol and transmitting the second information during a second time slot of the protocol.