发明申请
- 专利标题: BACKLIT KEY ASSEMBLY HAVING A REDUCED THICKNESS
- 专利标题(中): 具有减小厚度的背板组件
-
申请号: US12560511申请日: 2009-09-16
-
公开(公告)号: US20100213041A1公开(公告)日: 2010-08-26
- 发明人: Chao CHEN , Jana Lynn PAPKE , Dietmar Frank WENNEMER
- 申请人: Chao CHEN , Jana Lynn PAPKE , Dietmar Frank WENNEMER
- 申请人地址: CA Waterloo
- 专利权人: RESEARCH IN MOTION LIMITED
- 当前专利权人: RESEARCH IN MOTION LIMITED
- 当前专利权人地址: CA Waterloo
- 主分类号: H01H13/70
- IPC分类号: H01H13/70
摘要:
A backlit key assembly having a reduced thickness for an electronic device, and an electronic device having such a backlit key assembly are provided. The key assembly utilizes a local sink (recess) in a backing plate of the key assembly to lower the light source (e.g. LED) and flexible printed circuit board relative to the backing plate. The key assembly described herein provides a suitable leading space for the light source while permitting the overall thickness of the key assembly to be reduced compared with conventional backlit key designs.
公开/授权文献
- US08263887B2 Backlit key assembly having a reduced thickness 公开/授权日:2012-09-11
信息查询