发明申请
US20100213041A1 BACKLIT KEY ASSEMBLY HAVING A REDUCED THICKNESS 有权
具有减小厚度的背板组件

BACKLIT KEY ASSEMBLY HAVING A REDUCED THICKNESS
摘要:
A backlit key assembly having a reduced thickness for an electronic device, and an electronic device having such a backlit key assembly are provided. The key assembly utilizes a local sink (recess) in a backing plate of the key assembly to lower the light source (e.g. LED) and flexible printed circuit board relative to the backing plate. The key assembly described herein provides a suitable leading space for the light source while permitting the overall thickness of the key assembly to be reduced compared with conventional backlit key designs.
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