A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an electronic component includes a cooling cycle device having a refrigerant passage circulating through a compressor, a condenser, an expander, and an evaporator; a thermally conductive block having an outer surface capable of coming in contact with the electronic component that is an object to be temperature-controlled, where an inner surface corresponding to the outer surface is placed opposite to the outer surface so as to be brought in contact with or apart from the evaporator; at least one first heater for heating the thermally conductive block; and a compressed air feeding circuit for feeding compressed air between facing surfaces of the evaporator and the thermally conductive block to part them.