发明申请
- 专利标题： PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM
- 专利标题（中）： 标准集成电路附件电影
-
申请号： US12778931申请日： 2010-05-12
-
公开(公告)号： US20100221671A1公开(公告)日： 2010-09-02
- 发明人: Nagesh Ramachandra , Brian Robert Brown , Norman Michael Berry , Garry Raymond Jackson , Paul Timothy Sharp , John Douglas Peter Morgan , Kia Silverbrook , Akira Nakazawa , Michael John Hudson , Christopher Hibbard , Samuel George Mallinson , Paul Justin Reichl
- 申请人： Nagesh Ramachandra , Brian Robert Brown , Norman Michael Berry , Garry Raymond Jackson , Paul Timothy Sharp , John Douglas Peter Morgan , Kia Silverbrook , Akira Nakazawa , Michael John Hudson , Christopher Hibbard , Samuel George Mallinson , Paul Justin Reichl
- 专利权人： Silverbrook Research Pty Ltd
- 当前专利权人： Silverbrook Research Pty Ltd
- 优先权： AU2006901084 20060303; AU2006901287 20060307; AU2006201083 20060315
- 主分类号： G03F7/20
- IPC分类号： G03F7/20
摘要：
A method of fabricating a film used in attaching a printhead integrated circuit to an ink supply manifold is disclosed. An adhesive polymeric film having a protective liner is provided. Photoresist is then deposited onto the protective liner, and the photoresist is photopatterned. Ink supply holes are etched through the adhesive polymeric film and the protective liner, with the photoresist acting as a mask for the etching. Finally, the protective liner including the photoresist is removed from the adhesive polymeric film after the etching step is complete.
信息查询
IPC分类:
