发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLEX TAPE AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有柔性带的集成电路包装系统及其制造方法
-
申请号： US12717085申请日： 2010-03-03
-
公开(公告)号： US20100224978A1公开(公告)日： 2010-09-09
- 发明人: Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan
- 申请人： Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a device to the substrate; providing interconnects on the substrate; and forming a flexible tape substantially conformal to the device and contacting the interconnects.