Invention Application
- Patent Title: SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US12716399Application Date: 2010-03-03
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Publication No.: US20100244074A1Publication Date: 2010-09-30
- Inventor: Takafumi Oka , Shinji Abe , Kazushige Kawasaki , Junichi Horie , Hitoshi Sakuma
- Applicant: Takafumi Oka , Shinji Abe , Kazushige Kawasaki , Junichi Horie , Hitoshi Sakuma
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2009-082033 20090330
- Main IPC: H01L33/58
- IPC: H01L33/58

Abstract:
A semiconductor light-emitting device and a manufacturing method are provided, in which a metal film is deposited with positional differences between edges of an insulating film and the metal film, opposite a ridge waveguide top face, utilizing an overhanging-shaped resist pattern. An opening through the insulating film is extended in width without another masking step by etching the insulation film on the ridge waveguide top face, using the metal film as a mask. The contact area between a p-side electrode and a p-type contact layer is increased and operating voltage of the semiconductor light-emitting device is reduced.
Information query
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