发明申请
- 专利标题: Chip stack package and method of fabricating the same
- 专利标题(中): 芯片堆叠封装及其制造方法
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申请号: US12656322申请日: 2010-01-26
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公开(公告)号: US20100244233A1公开(公告)日: 2010-09-30
- 发明人: Pyoung-wan Kim , Min-seung Yoon , Nam-seog Kim , Keum-hee Ma
- 申请人: Pyoung-wan Kim , Min-seung Yoon , Nam-seog Kim , Keum-hee Ma
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2009-0027755 20090331
- 主分类号: H01L23/538
- IPC分类号: H01L23/538 ; H01L25/07
摘要:
Provided is a chip stack package and a method of manufacturing the same. A chip stack package may include a base chip including a base substrate, a base through via electrode penetrating the base substrate, a base chip pad connected to the base through via electrode, and a base encapsulant. The chip stack package may further include at least one stack chip on a surface of the base substrate. The chip stack package may also include an external connection terminal connected to the base through via electrode and the base chip pad and protruding from the base encapsulant, and an external encapsulant surrounding and protecting outer surfaces of the base chip and the at least one stack chip, wherein the chip through via electrode and the chip pad are connected to the base through via electrode and the base chip pad of the base chip.
公开/授权文献
- US08373261B2 Chip stack package and method of fabricating the same 公开/授权日:2013-02-12