发明申请
- 专利标题: Assembly of Radiofrequency Chips
- 专利标题(中): 射频芯片组装
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申请号: US12665419申请日: 2008-06-18
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公开(公告)号: US20100245182A1公开(公告)日: 2010-09-30
- 发明人: Dominique Vicard , Jean Brun , Benoit Lepine
- 申请人: Dominique Vicard , Jean Brun , Benoit Lepine
- 申请人地址: FR Paris
- 专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE
- 当前专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE
- 当前专利权人地址: FR Paris
- 优先权: FR0704445 20070621
- 国际申请: PCT/FR08/51079 WO 20080618
- 主分类号: H01Q1/24
- IPC分类号: H01Q1/24 ; H01L21/98
摘要:
The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.
公开/授权文献
- US08471773B2 Assembly of radiofrequency chips 公开/授权日:2013-06-25
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