A heat dissipation apparatus includes a heat sink, a fan, and a fixing structure. The fan defines a number of fixing holes. The fixing structure includes a base, two resilient side panels bent from two sides of the base. The base and the side panels bound an accommodating space to accommodate the fan. An airflow opening is defined in the base for allowing air to flow between the heat sink and the fan. First ends of a number of fasteners secure the base of the fixing structure to the heat sink. Second ends of the number of fasteners protrude through the base into the accommodating space, to be accommodated in the corresponding fixing holes of the fan.