发明申请
- 专利标题: RESIN SEALING APPARATUS
- 专利标题(中): 树脂密封装置
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申请号: US12438535申请日: 2007-09-13
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公开(公告)号: US20100247697A1公开(公告)日: 2010-09-30
- 发明人: Kenji Ogata , Shin Nagaoka
- 申请人: Kenji Ogata , Shin Nagaoka
- 优先权: JP2006-252936 20060919
- 国际申请: PCT/JP2007/067835 WO 20070913
- 主分类号: B29C33/30
- IPC分类号: B29C33/30
摘要:
There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.
公开/授权文献
- US08342837B2 Resin sealing apparatus 公开/授权日:2013-01-01
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