发明申请
US20100251547A1 METHOD OF MANUFACTURING A HEAT TRANSPORT DEVICE, HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND CAULKING PIN
审中-公开
热交换装置的制造方法,热传输装置,电子装置和密封件
- 专利标题: METHOD OF MANUFACTURING A HEAT TRANSPORT DEVICE, HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND CAULKING PIN
- 专利标题(中): 热交换装置的制造方法,热传输装置,电子装置和密封件
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申请号: US12731355申请日: 2010-03-25
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公开(公告)号: US20100251547A1公开(公告)日: 2010-10-07
- 发明人: Takashi Yajima , Kazuo Goto , Keitaro Yamashita , Kazuya Sakamoto
- 申请人: Takashi Yajima , Kazuo Goto , Keitaro Yamashita , Kazuya Sakamoto
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-092782 20090407
- 主分类号: B21D53/02
- IPC分类号: B21D53/02
摘要:
A method of manufacturing a heat transport device includes injecting a working fluid that transports heat by a phase change into a casing through an injection opening of the casing under reduced pressure, sealing an injection path by caulking under the reduced pressure, the injection path being provided in the casing into which the working fluid is injected and causing the injection opening and an action area in which the phase change of the working fluid occurs to communicate with each other, contacting a peripheral area of the injection opening of the casing with an inner surface of the injection path by caulking the peripheral area, the peripheral area including the injection opening, and sealing the injection opening by welding a part of the casing contacted.
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