发明申请
- 专利标题： PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE
- 专利标题（中）： 具有半导体器件和集成电路的封装及其制造方法
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申请号： US12544415申请日： 2009-08-20
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公开(公告)号： US20100258950A1公开(公告)日： 2010-10-14
- 发明人: GANG LI , Wei Hu , Jia-Xin Mei
- 申请人： GANG LI , Wei Hu , Jia-Xin Mei
- 优先权： CN200910049305.0 20090414
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/50
摘要：
A multichip package includes a first chip and a second chip coupled with the first chip. The first chip includes a first base with a semiconductor device mounted on one side of the first base, a first electrical connection unit, a first bonding ring surrounding the semiconductor device, a first insulating layer formed on the other side of the first base and a first external bonding portion formed on the first insulating layer. The first external bonding portion is electrically connected to the first electrical connection unit. The second chip includes an integrated circuit corresponding to the semiconductor device, a second electrical connection unit fusing with the first electrical connection unit, and a second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit.
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