发明申请
- 专利标题: METHOD FOR ISOLATING FLEXIBLE SUBSTRATE FROM SUPPORT SUBSTRATE
- 专利标题(中): 从支撑基板分离柔性基板的方法
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申请号: US12571833申请日: 2009-10-01
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公开(公告)号: US20100264112A1公开(公告)日: 2010-10-21
- 发明人: Liang-You JIANG , Janglin Chen , Yu-Yang Chang , Dong-Sen Chen
- 申请人: Liang-You JIANG , Janglin Chen , Yu-Yang Chang , Dong-Sen Chen
- 优先权: TW098112767 20090417
- 主分类号: B32B38/10
- IPC分类号: B32B38/10 ; B32B38/00 ; B32B38/04
摘要:
A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.