发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE AND METHOD FOR MANUFACTURING THEREOF
- 专利标题（中）： 具有引线封装的集成电路封装系统及其制造方法
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申请号： US12822954申请日： 2010-06-24
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公开(公告)号： US20100264525A1公开(公告)日： 2010-10-21
- 发明人: Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Henry Descalzo Bathan , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Henry Descalzo Bathan , Lionel Chien Hui Tay
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.
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