发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 集成电路封装系统，内置铅和叠层及其制造方法
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申请号： US12823079申请日： 2010-06-24
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公开(公告)号： US20100264529A1公开(公告)日： 2010-10-21
- 发明人: Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho , Arnel Trasporto
- 申请人： Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho , Arnel Trasporto
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
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